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        Differences between TI CC2640R2L and CC2640R2F

        2021-05-28 13:36:44 RFstar

        The CC2640R2L recently launched by TI (Texas Instruments) is a 2.4 GHz wireless microcontroller (MCU) supporting Bluetooth? 5.1 features: LE Coded PHYs (Long Range), LE 2-Mbit PHY (High Speed), Advertising Extensions, Multiple Advertisement Sets, as well as backwards compatibility and support for key features from the Bluetooth? 5.0 and earlier Low Energy specifications. CC2640R2L and CC2640R2F both use a single-core software development kit (SDK) and a rich tool set to share a common and easy-to-use development environment. The low-power wireless microcontrollers CC2640R2F and CC2640R2L, both launched by Texas Instruments, can transmit and receive radio frequency signals with a larger range.


        CC2640R2L, as a low-cost version of CC2640R2F, is lower in price.


        Judging from the Bluetooth protocol supported by the chip, CC2640R2F supports BLE 5.0 protocol, and CC2640R2L supports BLE 5.1 protocol. CC2640R2L can use AOA/AOD for indoor positioning, which is very suitable for improving the performance of Internet of Things (IoT) applications.

        In terms of cores, both CC2640R2L and CC2640R2F are the same: 48 MHz ARM? Cortex?-M3 cores, and they both have 275 KB non-volatile memory, including 128 KB in-system programmable flash, up to 28 KB system SRAM, of which 20 KB is ultra-low leakage SRAM. Compared with CC2640R2F, CC2640R2L does not have a Sensor Controller Engine, so the cost of CC2640R2L is lower and it is more suitable for the application scenarios of basic transparent transmission function.

        CC2640R2L:

        Microcontroller

        • Powerful Arm? Cortex? -M3

        • Up to 48 MHz clock speed

        • 275 KB of nonvolatile memory including 128 KB of in-system programmable flash

        • Up to 28 KB of system SRAM, of which 20 KB is ultra-low leakage SRAM

        • 8 KB of SRAM for cache or system RAM use

        • Supports over-the-air upgrade (OTA)


        RoHS-compliant packages

        • 5 mm × 5 mm RHB VQFN32 (15 GPIOs)

        • 7 mm × 7 mm RGZ VQFN48 (31 GPIOs)

        Peripherals

        • All digital peripheral pins can be routed to any GPIO

        • Four general-purpose timer modules (eight 16 bit or four 32 bit timers, PWM each)

        • UART, IIC, and IIS

        • Real-time clock (RTC)

        • AES-128 security module

        • Integrated temperature sensor

        Low power

        • Wide supply voltage range

        • Normal operation: 1.8 V to 3.8 V

        • External regulator mode: 1.7 V to 1.95 V

        RF section

        • 2.4-GHz RF transceiver compatible with Bluetooth low energy 5.1 and earlier LE specifications

        • Excellent receiver sensitivity (–97 dBm for BLE), selectivity, and blocking performance

        • Programmable output power up to +5 dBm

        • Single-ended or differential RF interface


        CC2640R2F:

        Microcontroller

        • Powerful Arm? Cortex? -M3

        • Up to 48 MHz clock speed

        • 275 KB of nonvolatile memory including 128 KB of in-system Programmable Flash

        • Up to 28 KB of system SRAM, of which 20 KB is ultra-low leakage SRAM

        • 8KB of SRAM for cache or system RAM use

        • Supports over-the-air upgrade (OTA)

        RoHS-compliant packages

        • 2.7 mm × 2.7 mm YFV DSBGA34 (14 GPIOs)

        • 4 mm × 4 mm RSM VQFN32 (10 GPIOs)

        • 5 mm × 5 mm RHB VQFN32 (15 GPIOs)

        • 7 mm × 7 mm RGZ VQFN48 (31 GPIOs)

        Peripherals

        • All digital peripheral pins can be routed to any GPIO

        • Four general-purpose timer modules (eight 16 bit or four 32 bit timers, PWM each)

        • 12 bit ADC, 200MSPS, 8 channel analog MUX

        Low power

        • Wide supply voltage range

        • Normal operation: 1.8 V to 3.8 V

        • External regulator mode: 1.7 V to 1.95 V

        • Shutdown: 100 nA (wake up on external events)

        RF section

        • 2.4 GHz RF transceiver compatible with Bluetooth? Low Energy 5.1 and earlier LE specifications

        • Excellent receiver sensitivity (–97 dBm for BLE), selectivity, and blocking performance

        • Programmable output power up to +5 dBm

        • Single-ended or differential RF interface

        RF-star has launched the CC2640R2L module, which has a lower cost and high performance. As early as January 21st, 2019, the Bluetooth SIG announced the Core specification 5.1, introducing the long-awaited AoA/AoD features. AoA/AoD is a positioning algorithm based on angle of arrival angle/ angle of departure. The Bluetooth 5.1 device senses the arrival /departure direction of the transmitting node signal, and calculates the relative position or angle between the arrival node and the departure node. Then use triangulation or other methods to calculate the location of the unknown node, which is very suitable for indoor positioning applications of the Internet of Things.

        Now more and more manufacturers support the Bluetooth 5.1. Bluetooth 5.1 has many advantages in indoor positioning. The module with CC2640R2L chip has a lower cost and supports BLE 5.1, which can meet more needs of users. For example, the strong comprehensive performance RF-BM-4077B1L and RF-BM-4055B1L module launched by RF-star.

        RF-star has focused on the Bluetooth field for ten years and has rich experience in solution design. The Bluetooth module of RF-star Technology performed pretty well.

        RF-star Technology is a well-known and reputable wireless RF solution provider and low-power RF core device supplier. Its products include a wealth of TI series products, such as CC2640R2L. Professional technical support team provides professional customized services for every client. For more TI solutions, please pay attention to RF-star Technology.


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